New tech, new ties : how mobile communication is reshaping social cohesion /

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Bibliographic Details
Main Author: Ling, Richard Seyler.
Format: Book
Language:English
Published: Cambridge, Mass. ; London : MIT Press, [2010]
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EJWL - 3rd Floor

Holdings details from EJWL - 3rd Floor
Call Number: HE9713 .M43 2010
Copy 1 Available